AIRCC Publishing Corporation

www.airccse.org

Advances in Interconnect Technologies: An International Journal(AITIJ) January 9, 2017

Filed under: Uncategorized — AIRCC INTERNATIONAL JOURNALS - CONFERENCES @ 9:34 am

 

http://airccse.com/aitij/index.html

 Call for papers

Advances in Interconnect Technologies: An International Journal (AITIJ) invites original and significant contributions relating to the theory, design, performance and reliability of interconnect, including materials, analysis, modeling and simulation of interconnect. The journal proposes to stimulate the development of latest technology in industry and academia. High quality review papers and short communications are also acceptable.

Topics of the interests:

  •  Emerging Materials
  • CNT/ Graphene Interconnects
  • Modeling and Simulation
  • Testing
  • RFIC
  • Optical Interconnects
  • Wireless Interconnects
  • Microstrip Lines
  • Analog and Mixed Signals
  • Dedicated Software and Systems for Developing Interconnect Technology
  • On-Chip and Off-Chip Interconnects
  • EMC/EMI
  • FPGA/ASICs
  • Fabrication Techniques
  • Neural Networks
  • Parasitics Issues
  • Optimization Techniques

Paper Submission

            Authors are invited to submit papers for this journal through E-mail:aitijjournal@airccse.com Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this Journal.

Important Dates 

  • Submission Deadline:  February 04, 2017
  • Notification         :  March 12, 2017
  • Final Manuscript Due:  March 14, 2017
  • Publication Date     :  Determined by the Editor-in-Chief

For other details please visit http://airccse.com/aitij/index.html

 

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